ASUS TUF Gaming B550-PLUS WiFi II AMD AM4 (3rd Gen Ryzen™) ATX Motherboard (PCIe 4.0, 6, 2.5Gb LAN, BIOS Flashback, USB 3.2 2, Addressable 2 RGB Header and Aura Sync) - Technodel Lebanon | Technodel Lebanon
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ASUS
ASUS TUF Gaming B550-PLUS WiFi II AMD AM4 (3rd Gen Ryzen™) ATX Motherboard (PCIe 4.0, 6, 2.5Gb LAN, BIOS Flashback, USB 3.2 2, Addressable 2 RGB Header and Aura Sync
$122
ASUS TUF Gaming B550-PLUS WiFi II AMD AM4 (3rd Gen Ryzen™) ATX Motherboard (PCIe 4.0, 6, 2.5Gb LAN, BIOS Flashback, USB 3.2 2, Addressable 2 RGB Header and Aura Sync - Available at Technodel Lebanon with warranty.
From the manufacturer ASUS is one of Fortune magazine’s World’s Most Admired Companies and is one of the top motherboard and gaming brands, as well as a top-three consumer notebook vendor. ASUS is driven by passion and innovation and dedicated to creating quality products for a future smart life, designing and manufacturing products that perfectly meet the needs of today’s digital home, office and person. Our wide portfolio includes MG248Q, Chromebox and a range of devices and components, along with AR and VR. TUF GAMING B550-PLUS WIFI II AMD B550 (Ryzen AM4) ATX Gaming Motherboard with PCIe 4.0, Dual M.2, 10-Phase DrMOS Power Supply, Wi-Fi 6, 2.5Gb Ethernet, HDMI, DisplayPort, SATA 6Gbps, USB 3.2 Gen 2 Type-A and Type-C, Thunderbolt 3 connector and Aura Sync RGB lighting support AMD AM4 socket: Ready for Ryzen 5000/ 4000 Series G/3000 Series Desktop Processors Advanced Power Solution: 8+2 phases of DrMOS power, ProCool socket, military-grade TUF components and Digi+ VRM for maximum life Full Cooling: Heatsinks for VRM, fanless PCH and Dual M.2, connectors for hybrid fans and fan Xpert 4 utilities Next-gen connectivity: PCIe 4.0 M.2, USB 3.2 Gen 2 Type-A and Type-C, Thunderbolt 3 header support Made for online gaming: Wi-Fi 6, 2.5 Gb Ethernet and TUF LANGuard AI Noise-Canceling Microphone: Provides clear and crystal clear voice communication while playing DrMOS File The VRM built into the TUF Gaming B550-PLUS WIFI II uses 8+2 drMOS power phases that combine MOSFETs and high-side and low-side drivers in one package, delivering all the power and efficiency required by AMD Ryzen 3rd generation processors. Effective Cooling 1. VRM HEATSINK VRM HEATSINK A large high-mass heat sink with a large surface covering VRM and overheating areas to improve heat dissipation. THERMAL PAD A high-quality thermal pad helps transfer heat from the inductor and phase array to the heat sink. 2. M.2 DISSIPATORS The M.2 he